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A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis

• Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies

• Prepare large area FIB-cross-sections up to 1 mm wide

• Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted

• Live SEM-monitoring during FIB milling for precise end-pointing

• Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast

• Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents

• Essence? easy-to-use modular user interface

Complement TESCAN Solaris X capabilities with stand-alone laser ablation, which significantly improves time-to-result for large volume milling or access to deeply buried regions of interest, and frees the Plasma FIB for final targeted material removal, sample thinning or cross-section polishing.